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[Date Prev][Date Next][Thread Prev][Thread Next][Date Index][Thread Index]Re: [tlug] Golden Chips
- Date: Fri, 25 Nov 2005 21:54:40 -0500
- From: Jim <jep200404@example.com>
- Subject: Re: [tlug] Golden Chips
- References: <43842ECD.9040800@example.com> <4386FF7F.2000103@example.com> <43870FCE.8090204@example.com> <20051125085609.3319d85b.jep200404@example.com> <d8fcc0800511250634q6b9a2da4oe4eeef20651e1599@example.com> <d8fcc0800511251641s1a3f9048i448c6e90100f2e07@example.com> <4387C693.8030401@example.com>
"Lyle (Hiroshi) Saxon" <ronfaxon@example.com> wrote: > (don't they use gold for parts of IC chips, etc?) Gold is used little in the chips themselves. Probably mostly as a dopant. Gold used to be commonly used for bond wires from the package to the chip, both for its mechanical properties such as maleability and its ability to ultrasonically weld it. The package wire frame may also be gold plated. Both uses have been greatly reduced due to the expense of gold. Within a chip, most interconnects were aluminum until IBM's advance to use copper. Actually, most interconnects are probably still aluminum, reserving copper for the highest performance chips. http://en.wikipedia.org/wiki/Copper-based_chips
- References:
- [tlug] IBM R30 Laptop Issues
- From: Mark Sargent
- Re: [tlug] IBM R30 Laptop Issues
- From: Lyle (Hiroshi) Saxon
- Re: [tlug] IBM R30 Laptop Issues
- From: Mark Sargent
- Re: [tlug] IBM R30 Laptop Issues
- From: Jim
- Re: [tlug] IBM R30 Laptop Issues
- From: Josh Glover
- Re: [tlug] IBM R30 Laptop Issues
- From: Josh Glover
- Re: [tlug] IBM R30 Laptop Issues
- From: Lyle (Hiroshi) Saxon
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